JPH01112077U - - Google Patents
Info
- Publication number
- JPH01112077U JPH01112077U JP772788U JP772788U JPH01112077U JP H01112077 U JPH01112077 U JP H01112077U JP 772788 U JP772788 U JP 772788U JP 772788 U JP772788 U JP 772788U JP H01112077 U JPH01112077 U JP H01112077U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- equivalent
- lands
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP772788U JPH01112077U (en]) | 1988-01-22 | 1988-01-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP772788U JPH01112077U (en]) | 1988-01-22 | 1988-01-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01112077U true JPH01112077U (en]) | 1989-07-27 |
Family
ID=31212985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP772788U Pending JPH01112077U (en]) | 1988-01-22 | 1988-01-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01112077U (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016086070A (ja) * | 2014-10-24 | 2016-05-19 | 富士ゼロックス株式会社 | 基板及び基板装置並びに基板装置の製造方法 |
-
1988
- 1988-01-22 JP JP772788U patent/JPH01112077U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016086070A (ja) * | 2014-10-24 | 2016-05-19 | 富士ゼロックス株式会社 | 基板及び基板装置並びに基板装置の製造方法 |